Siqing Wei

Siqing Wei - profile photo

Siqing Wei

Assistant Professor

Rayen School of Engineering

Moser Hall 2425

phone: (330) 941-3114

swei@ysu.edu

scholar.google.com/citations?user=2QO7oGcAAAAJ&hl=en

Bio

Dr. Siqing Wei is an Assistant Professor at the Youngstown State University. He received a B.S. and M.S. in Electrical Engineering and a Ph.D. in Engineering Education program at Purdue University as a triple boiler. He was a postdoc fellow at the University of Cincinnati under the supervision of Dr. David Reeping. His research interests span several major research topics, which are teamwork, AI in education, cultural diversity, and international and Asian/ Asian American student experiences. He utilizes innovative and cutting-edge methods, such as person-centered approaches, NLP, ML, and Social Relation Models. He studies and promotes multicultural teaming experiences to promote an inclusive and welcoming learning space for all to thrive in engineering. Particularly, he aims to help students improve intercultural competency and teamwork competency through interventions, counseling, pedagogy, and mentoring. Siqing received the Outstanding Graduate Student Research Award in 2024 from Purdue College of Engineering, the Bilsland Dissertation fellow in the 2023-24 academic year, and the 2024 FIE New Faculty Fellow Award.

Research Interests

teamwork – team dynamics, team formation, peer evaluation
engineering culture and individual culture differences
international student learning experiences
AI in education

Teaching Interests

First-year engineering; Education research methods; introduction to engineering education research; quantitative research methods

  • 2025

    YSU Institute for Teaching & Learning

    ITL Mini-Grant

    This Mini Grant will support my teaching innovation for one session of my Engineering Computing to better teach students about teamwork. This project is titled: An introduction to teamwork in experiential and reflextive learning with spaghetti tower building activity

  • 2026

    "The Majority Rules Procedure: Aiming to Develop Alternative Approaches to Missing Data for Latent Profile Analysis"

    A. Jannini, S. Wei

    ASEE Annual Conference & Exposition
  • 2026

    "Examining Patterns in Community College Students’ Web Navigation for Transfer Information"

    Y. Han, D. Reeping, S. Wei

    ASEE Annual Conference & Exposition
  • 2026

    "Engage and retain students via engineering competition teams throughout the undergraduate engineering programs"

    S. Wei, E. Haake, R. Deschenes

    ASEE Annual Conference & Exposition
  • 2026

    "A scoping review of methods used to analyze engineering curricula quantitatively using curricular analytics"

    N. Rashedi, D. Reeping, S. Wei

    Engineering Education Review, Scholar Media Publishing

  • 2025

    "A Scoping Review on AI Integration in Engineering Education and its Impact on Students' Critical Thinking"

    F. Zarandi, M. Martin, S. Wei, D. Reeping

    IEEE/ASEE Frontiers in Education, p. 1-8
  • 2025

    "Supporting Teamwork in Blended and In-Person Delivery Modes in Large Class Size Through Cooperative Learning and Real-Time Collaboration Platforms"

    A. Magana, J. Rodriguez, S. Wei, S. Yoon, P. Thomas

    Active Learning in Higher Education, Sage Journals

  • 2025

    "The advantage of regression and covariate utilisation over ANOVA in engineering education research"

    L. Tan, S. Wei, X. Xu, J. Morphew

    European Journal of Engineering Education, Informa UK Limited, volume 50, issue 4, p. 878-908

  • 2025

    "A call to foster psychological safety to facilitate inclusive and effective engineering student teams and learning"

    S. Wei, Y. Han

    Engineering Education Review, Scholar Media Publishing, volume 2, issue 4, p. 172-181

  • 2025

    "Trends of teamwork behavioral effectiveness ratings in community colleges"

    S. Wei, D. Reeping, L. Tan, M. Ohland

    Research in Engineering Education Symposium (REES) & Regional Conference in Engineering Education (RCEE)
  • 2025

    "WIP: Professional development experiences from participation in an engineering cooperative education program"

    F. Mirzahosseini Zarandi, M. Martin, S. Wei, D. Reeping

    ASEE Conferences
  • 2025

    "WIP: Characterizing Personal Cultural Orientations of First-Year Engineering Students by Latent Profile Analysis: A Person-Centered Approach"

    S. Wei, A. Struck Jannini, D. Reeping

    ASEE Conferences
  • 2025

    "Exploring Threshold Concepts in Interdisciplinary Engineering Education: A Delphi Study in Cyber-Physical Systems"

    Y. Han, D. Reeping, S. Wei

    ASEE Conferences
  • 2025

    "BOARD # 89: WIP: Developing an Instrument to Understand Engineering Student uses of Digital External Resources from Solution Manuals to Generative AI"

    C. Calhoun, D. Reeping, S. Wei, A. Shah

    ASEE Conferences
  • 2024

    "WIP: Examining Psychological Distance Perceptions Towards Advanced Technologies among University Students"

    X. Xu, A. Dai, S. Wei, L. Tan

    IEEE/ASEE Frontiers in Education (FIE), p. 1-5
  • 2024

    "The effect of the emergency shift to virtual instruction on student team dynamics"

    S. Wei, L. Tan, Y. Zhang, M. Ohland

    European Journal of Engineering Education, Informa UK Limited, volume 49, issue 1, p. 139-163

  • 2024

    "Theorizing Neuro-Induced Relationships Between Cognitive Diversity, Motivation, Grit and Academic Performance in Multidisciplinary Engineering Education Context"

    D. Duong-Tran, S. Wei, L. Shen

    ASEE Annual Conference & Exposition

  • 2025 - present

    Reviewer, Journal Article
    European Journal of Engineering Education

  • 2025 - 2026

    Reviewer, Ad Hoc Reviewer
    IEEE Transcation on Education

  • 2025 - 2026

    Reviewer, Ad Hoc Reviewer
    ASEE North Central Section Cenference